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Short Description:

Base Material: FR4 TG170
PCB Thickness: 1.6+/-10%mm
Layer Count: 6L
Copper Thickness: 1Z
Surface treatment: ENIG 2U”
Solder mask: Black
Silkscreen: White
Special process : Impedance PCB


Product Detail

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Product Specification:

Base Material: FR4 TG170
PCB Thickness: 1.6+/-10%mm
Layer Count: 6L
Copper Thickness: 1Z
Surface treatment: ENIG 2U”
Solder mask: Black
Silkscreen: White
Special process : Impedance PCB

 


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