| Process capability parameter table | ||||
| Item | Sample （≤3 sq.m） |
Mass produce | ||
| 1 | Material type | Ordinary Tg FR4 | S1141, KB6160 |
S1141, KB6160 |
| 2 | Medium TG | KB6165, IT158 |
KB6165, IT158 |
|
| 3 | Ordinary Tg FR4 (halogen free) | S1150G, Lianmao：IT |
S1150G | |
| 4 | High TG FR-4 (halogen free) | S1165, Lianmao：IT |
S1165 | |
| 5 | High TG FR-4 | S1170, S1000-2, KB6167, KB6168, Lianmao：IT180A |
S1170, S1000-2, KB6167, KB6168, Lianmao：IT180A |
|
| 6 | High CTI (≥600) | S1600 KB7150 C | S1600 KB7150 C | |
| 7 | Min. dielectric thickness 0.26mm+/-0.05mm ( high CTI PP only is 7628, so a combination of 7628+1080 is required) |
Min. dielectric thickness 0.26mm+/-0.05mm ( high CTI PP only is 7628, so a combination of 7628+1080 is required) |
||
| 8 | Ceramic filled high frequency | Rogers4000 series Rogers3000 series |
Rogers4000 series Rogers3000 series |
|
| 9 | PTFE high frequency | Taconic series, Arlon series, Nelco series, Taizhou NetLing F4BK, TP series |
Taconic series, Arlon series, Nelco series, Taizhou NetLing F4BK, TP series |
|
| 10 | Mixed material | Rogers4000 series+FR4, Rogers3000 series+FR4, FR4+ aluminum base |
Rogers4000 series+FR4, Rogers3000 series+FR4 |
|
| 11 | Number of layers: ≤8 layers | Number of layers: ≤8 layers | ||
| 12 | PP limited to ordinary high TG FR4 (If Rogers PP required, customer needs to provide them) | / | ||
| 13 | Metal base | Single-sided copper base, single-sided aluminum base | Single-sided copper base, single-sided aluminum base | |
| 14 | PCB type | Multi-layer laminated for blind and buried | Pressing on the same side ≤ 4 times | Pressing on the same side ≤ 2 times |
| 15 | HDI board | 1+N+1 、 2+N+2 | 1+N+1 | |
| 16 | Number of layers | Ordinary FR4 high Tg | Layers 1-22, (high TG must be used for 10L and above) |
Layers 1-18, (high TG must be used for 10L and above) |
| 17 | Surface treatment | Surface treatment type (lead-free) | HASL-LF | HASL-LF |
| 18 | ENIG | ENIG | ||
| 19 | Immersion silver | Immersion silver | ||
| 20 | Immersion tin | Immersion tin | ||
| 21 | OSP | OSP | ||
| 22 | Immersion nickel palladium gold | Immersion nickel palladium gold | ||
| 23 | Plating hard gold | Plating hard gold | ||
| 24 | Plating gold fingers (including gold fingers segmented) | Plating gold fingers (including gold fingers segmented) | ||
| 25 | Immersion gold + OSP | Immersion gold + OSP | ||
| 26 | Immersion gold + plating gold fingers | Immersion gold + plating gold fingers | ||
| 27 | Immersion tin +plating gold finger | Immersion tin +plating gold finger | ||
| 28 | Immersion silver+plating gold finger | Immersion silver+plating gold finger | ||
| 29 | Surface treatment type (leaded) | HASL | HASL | |
| 30 | HASL + gold finger: the distance between HASL pad and gold finger | 3mm | 3mm | |
| 31 | Finished PCB size (MAX) | HASL:558*1016mm | HASL:558*610mm | |
| 32 | HASL-LF: 558*1016mm | HASL-LF: 558*610mm | ||
| 33 | Plating gold finger: 609*609mm | Plating gold finger: 609*609mm | ||
| 34 | Plating hard gold: 609*609mm | Plating hard gold: 609*609mm | ||
| 35 | ENIG: 530*685mm | ENIG: 530*610mm | ||
| 36 | Immersion tin: 406*533mm | Immersion tin: 406*533mm | ||
| 37 | Immersion silver: 457*457mm | Immersion silver: 457*457mm | ||
| 38 | OSP: 609*1016mm | OSP: 558*610mm | ||
| 39 | Immersion Nickel Palladium gold: 530*685mm | Immersion Nickel Palladium gold: 530*610mm | ||
| 40 | Finished PCB size (MIN) | HASL: 5*5mm | HASL: 50*50mm | |
| 41 | HASL-LF: 5*5mm | HASL-LF: 50*50mm | ||
| 42 | Plating gold finger:40*40mm | Plating gold finger:40*40mm | ||
| 43 | Plating hard gold 5*5mm | Plating hard gold 50*50mm | ||
| 44 | ENIG: 5*5mm | ENIG: 50*50mm | ||
| 45 | Immersion tin: 50*100mm | Immersion tin: 50*100mm | ||
| 46 | Immersion silver: 50*100mm | Immersion silver: 50*100mm | ||
| 47 | OSP: 50*100mm | OSP: 50*100mm | ||
| 48 | Immersion Nickel palladium gold: 5*5mm | Immersion Nickel palladium gold: 50*50mm | ||
| 49 | Panel units needed, Min. panel size 80*100mm |
/ | ||
| 50 | Board thickness | HASL- LF: 0.5-4.0mm | HASL- LF:1.0-4.0mm | |
| 51 | HASL: 0.6-4.0mm | HASL:1.0-4.0mm | ||
| 52 | Immersion Gold: 0.2-4.0mm | Immersion Gold: 0.6-4.0mm | ||
| 53 | Immersion Silver: 0.4-4.0mm | Immersion Silver: 1.0-4.0mm | ||
| 54 | Immersion Tin: 0.4-4.0mm | Immersion Tin:1.0-4.0mm | ||
| 55 | OSP: 0.4-4.0mm | OSP: 1.0-4.0mm | ||
| 56 | Immersion Nickel Palladium gold: 0.2-4.0mm |
Immersion Nickel Palladium gold: 0.6-4.0mm |
||
| 57 | Plating hard gold: 0.2-4.0mm | Plating hard gold: 1.0-4.0mm | ||
| 58 | Plating gold finger: 1.0-4.0mm | Plating gold finger: 1.0-4.0mm | ||
| 59 | ENIG+OSP: 0.2-4.0mm | ENIG+OSP: 1.0-4.0mm | ||
| 60 | ENIG+plating gold finger: 1.0-4.0mm | ENIG+plating gold finger:1.0-4.0mm | ||
| 61 | Immersion tin+plating gold finger: 1.0- 4.0mm |
Immersion tin+plating gold finger: 1.0- 4.0mm |
||
| 62 | immersion silver + plating gold finger: 1.0-4.0mm |
immersion silver + plating gold finger: 1.0-4.0mm |
||
| 63 | Surface treatment thickness | HASL | 2-40um (Tin surface size ≥20*20mm, the thinnest thickness is 0.4um; lead-free tin surface size ≥20*20mm,the thinnest thickness is 1.5um) |
2-40um (Tin surface size ≥20*20mm, the thinnest thickness is 0.4um; lead-free tin surface size ≥20*20mm,the thinnest thickness is 1.5um) |
| 64 | OSP | Film thickness: 0.2-0.3um | Film thickness: 0.2-0.3um | |
| 65 | Immersion gold | Gold thickness: 0.025-0.1um nickel thickness: 3-8um |
Gold thickness: 0.025-0.1um nickel thickness: 3-8um |
|
| 66 | Immersion Silver | Silver thickness: 0.2-0.4um | Silver thickness: 0.2-0.4um | |
| 67 | Immersion Tin | Tin thickness: 0.8-1.5um | Tin thickness: 0.8-1.5um | |
| 68 | Hard gold plating | Gold thickness: 0.1-1.3um | Gold thickness: 0.1-1.3um | |
| 69 | Immersion Nickel Palladium | Nickel thickness: 3-8um Palladium thickness: 0.05-0.15um Gold thickness: 0.05-0.1um |
Nickel thickness: 3-8um Palladium thickness: 0.05-0.15um Gold thickness: 0.05-0.1um |
|
| 70 | Carbon oil | 10-50um (carbon oil with resistance requirement cannot be made) | 10-50um (carbon oil with resistance requirement cannot be made) | |
| 71 | When there is (crossing) lines under the carbon oil layer | Secondary solder mask | Secondary solder mask | |
| 72 | Blue peelable mask | Thickness: 0.2-0.5mm Conventional model: Peters2955 |
Thickness: 0.2-0.5mm Conventional model: Peters2955 |
|
| 73 | 3M tape | 3M brand | 3M brand | |
| 74 | Heat resistant tape | Thickness: 0.03-0.07mm | Thickness: 0.03-0.07mm | |
| 75 | Drilling | Maximum PCB thickness with 0.15mm mechanical drilling | 1.0mm | 0.6mm |
| 76 | Maximum PCB thickness with 0.2mm mechanical drilling | 2.0mm | 1.6mm | |
| 77 | Position tolerance for mechanical holes | +-3mil | +-3mil | |
| 78 | Finished diameter of mechanical hole | The Min. hole size for metallized half hole is 0.3mm | The Min. hole size for metallized half hole is 0.5mm | |
| 79 | The Min. hole size for PTFE material (including mixed pressure) board is 0.25mm | The Min. hole size for PTFE material (including mixed pressure) board is 0.3mm | ||
| 80 | The Min. hole size for metal base is 1.0mm | / | ||
| 81 | Ceramic filled high frequency plate (including mixed pressure): 0.25mm | Ceramic filled high frequency plate (including mixed pressure): 0.25mm | ||
| 82 | Maximum mechanical through-hole: 6.5mm. If it exceeds 6.5mm, reaming bit needed, and the hole diameter tolerance is +/-0.1mm |
Maximum mechanical through-hole: 6.5mm. If it exceeds 6.5mm, reaming bit needed, and the hole diameter tolerance is +/-0.1mm | ||
| 83 | Mechanical blind buried hole diameter ≤0.3mm | Mechanical blind buried hole diameter ≤0.3mm | ||
| 84 | Through hole PCB thickness-diameter ratio | Max. 10:1 (exceeding 10:1, PCB needs to be produced according to our company's structure) | Max. 8:1 | |
| 85 | Mechanical control depth drilling, blind hole depth-diameter ratio | 1 ：1 | 0.8 ： 1 | |
| 86 | The minimum distance between via and etching lines of inner layers (original file) | 4L：6mil | 4L：7mil | |
| 87 | 6L：7mil | 6L： 8mil | ||
| 88 | 8L：8mil | 8L： 9mil | ||
| 89 | 10L: 9mil | 10L：10mil | ||
| 90 | 12L：9mil | 12L：12mil | ||
| 91 | 14L：10mil | 14L：14mil | ||
| 92 | 16L：12mil | / | ||
| 93 | The minimum distance between mechanical drilling blind and etching lines of inner layers (original file) | Once press：8mil | Once press：10mil | |
| 94 | Twice presses：10mil | Twice presses：14mil | ||
| 95 | Three times presses：16mil | / | ||
| 96 | Min. distance between hole walls of different network | 10mil (After dilating） | 12mil (After dilating） | |
| 97 | Min. distance between hole walls of same network | 6mil (After dilating） | 8mil (After dilating） | |
| 98 | Min. NPTH tolerance | ±2mil | ±2mil | |
| 99 | Min. tolerance for press-fit holes | ±2mil | ±2mil | |
| 100 | Step hole depth tolerance | ±6mil | ±6mil | |
| 101 | Conical hole depth tolerance | ±6mil | ±6mil | |
| 102 | Diameter tolerance of Conical hole | ±6mil | ±6mil | |
| 103 | Angle and tolerance of Conical hole | Angle: 82°, 90°, 100°; angle tolerance +/-10° | Angle: 82°, 90°, 100°; angle tolerance +/-10° | |
| 104 | Min drilling slot diameter (finished product) | PTH slot: 0.4mm; NPTH slot: 0.5mm | PTH slot: 0.4mm; NPTH slot: 0.5mm | |
| 105 | Resin plug hole diameter of the hole in the disk (drill knife) | 0.15-0.65mm（Board thickness range：0.4-3.2mm) | 0.15-0.65mm（Board thickness range：0.4-3.2mm) | |
| 106 | Electroplating hole diameter (drill knife) | 0.15-0.3mm (The board must use high TG) | / | |
| 107 | Hole copper thickness | Mechanical blind buried hole 18-20um, mechanical via: 18-25um | Mechanical blind buried hole 18-20um, mechanical via: 18-25um | |
| 108 | Mechanical plug-in hole: 18-35um | Mechanical plug-in hole: 18-35um | ||
| 109 | Etching ring | The smallest ring size of mechanical hole of outer layers and inner layers | Base copper 1/3OZ, after via dilating: 3mil; after component hole dilating: 4mil |
Base copper 1/3OZ, after via dilating: 4mil; after component hole dilating: 5mil |
| 110 | Base copper 1/2OZ, after via dilating: 3mil; after component hole dilating: 5mil |
Base copper 1/2OZ, after via dilating: 4mil; after component hole dilating: 6mil |
||
| 111 | Base copper 1OZ, after via dilating: 5mil; after component hole dilating: 6mil |
Base copper 1OZ, after via dilating: 5mil; after component hole dilating: 6mil |
||
| 112 | Minimum diameter of BGA pad (original) | Finished copper thickness 1/1OZ: minimum 10mil for HASL board; minimum 8mil for other surface boards | Finished copper thickness 1/1OZ: minimum 12mil for HASL board; minimum 10mil for other surface boards | |
| 113 | Finished copper thickness 2/2OZ: minimum 14mil for HASL board; minimum 10mil for other surface boards | Finished copper thickness 2/2OZ: minimum 14mil for HASL board; minimum 12mil for other surface boards | ||
| 114 | Line width and spacing (original) | Inner layer | 1/2OZ：3/3mil | 1/2OZ：4/4mil |
| 115 | 1/1OZ：3/4mil | 1/1OZ：5/5mil | ||
| 116 | 2/2OZ：5/5mil | 2/2OZ：6/6mil | ||
| 117 | 3/3OZ：5/8mil | 3/3OZ：5/9mil | ||
| 118 | 4/4OZ：6/11mil | 4/4OZ：7/12mil | ||
| 119 | 5/5OZ：7/14mil | 5/5OZ：8/15mil | ||
| 120 | 6/6OZ：8/16mil | 6/6OZ：10/18mil | ||
| 121 | Outer layer | 1/3OZ: 3/3mil Line density: The proportion of 3mil line to the entire surface (including copper surface, substrate, circuit) is ≤10% |
/ | |
| 122 | 1/2OZ: 3/4mil Line density: the proportion of 3mil wires to the entire surface (including copper surface, substrate, circuit) ≤10% |
1/2OZ: 4/4mil Line density: the proportion of 3mil wires to the entire surface (including copper surface, substrate, circuit) ≤20% |
||
| 123 | 1/1OZ：4.5/5mil | 1/1OZ：5/5.5mil | ||
| 124 | 2/2OZ：6/7mil | 2/2OZ：6/8mil | ||
| 125 | 3/3OZ：6/10mil | 3/3OZ：6/12mil | ||
| 126 | 4/4OZ：8/13mil | 4/4OZ：8/16mil | ||
| 127 | 5/5OZ：9/16mil | 5/5OZ：9/20mil | ||
| 128 | 6/6OZ：10/19mil | 6/6OZ：10/22mil | ||
| 129 | 7/7OZ：11/22mil | 7/7OZ：11/25mil | ||
| 130 | 8/8OZ：12/26mil | 8/8OZ：12/30mil | ||
| 131 | 9/9OZ：13/30mil | 9/9OZ：13/32mil | ||
| 132 | 10/10OZ：14/35mil | 10/10OZ：14/35mil | ||
| 133 | 11/11OZ：16/40mil | 11/11OZ：16/45mil | ||
| 134 | 12/12OZ：18/48mil | 12/12OZ：18/50mil | ||
| 135 | 13/13OZ：19/55mil | 13/13OZ：19/60mil | ||
| 136 | 14/14OZ：20/60mil | 14/14OZ：20/66mil | ||
| 137 | 15/15OZ：22/66mil | 15/15OZ：22/70mil | ||
| 138 | 16/16OZ：22/70mil | 16/16OZ：22/75mil | ||
| 139 | Line width/spacing tolerance | 6-10mil：+/-10% <6mil:+-1mil |
≤10mil：+/-20% | |
| 140 | >10mil：+/-15% | >10mil： +/-20% | ||
| 141 | Different Copper thickness(um) | 18/35、35/70、18/70、35/105、70/105 | 18/35、35/70、18/70、35/105、70/105 | |
| 142 | Solder mask/character | The color of solder mask ink | Green, yellow, black, blue, red, gray, white, purple, orange, matt green, matt black, matt blue, brown, transparent oil | Green, yellow, black, blue, red, white, purple, orange, matt green, matt black, matt blue, transparent oil |
| 143 | Multiple ink mixing | One layer of solder mask with two colors, two layers with different colors | Two layers with different colors | |
| 144 | Maximum plug hole diameter of solder mask ink | 0.65mm | 0.5mm | |
| 145 | Character ink color | White, black, yellow, gray, blue, red, green | White, black, yellow, gray, blue, red, green | |
| 146 | Character height/width | 28*4mil | 28*4mil | |
| 147 | Solder mask opening | Unilateral 1mil | Unilateral 3mil | |
| 148 | Solder mask location tolerance | +/-2mil | +/-3mil | |
| 149 | Minimum width/height of negative characters of solder mask | HASL board: 0.3mm*0.8mm, Other boards 0.2mm*0.8mm |
HASL board: 0.3mm*0.8mm, Other boards 0.2mm*0.8mm |
|
| 150 | Solder mask bridge | Glossy Green: 3mil | Glossy Green: 4mil | |
| 151 | Matt color: 4mil (matt black must be 5mil) | Matt color: 5mil (matt black must be 6mil) | ||
| 152 | Others: 5mil | Others: 6mil | ||
| 153 | Profile | Profile tolerance | +/-4mil | +/-5mil |
| 154 | Minimum tolerance for milling slots（PTH) | +/-0.13mm | +/-0.13mm | |
| 155 | Minimum tolerance for milling slots（NPTH) | +/-0.1mm | +/-0.1mm | |
| 156 | Depth tolerance of controlled depth milling | +/-4mil | +/-6mil | |
| 157 | The distance between etching line to board edge | 8mil | 10mil | |
| 158 | The distance between V-CUT and copper line(T=board thickness) | T<=0.4 mm Angle30°: 0.25mm Angle 45°: 0.3mm Angle 60°: 0.4mm |
T<=0.4 mm Angle30°: 0.25mm Angle 45°: 0.3mm Angle 60°: 0.4mm |
|
| 159 | 0.4mm<T≤0.8mm Angle30°: 0.3mm Angle 45°: 0.35mm Angle 60°: 0.4mm |
0.4mm<T≤0.8mm Angle30°: 0.3mm Angle 45°: 0.35mm Angle 60°: 0.4mm |
||
| 160 | 0.8mm<T≤1.20mm Angle30°: 0.4mm Angle 45°: 0.45mm Angle 60°: 0.55mm |
0.8mm<T≤1.20mm Angle30°: 0.4mm Angle 45°: 0.45mm Angle 60°: 0.55mm |
||
| 161 | 1.20mm<T≤1.80mm Angle30°: 0.45mm Angle 45°: 0.5mm Angle 60°: 0.65mm |
1.20mm<T≤1.80mm Angle30°: 0.45mm Angle 45°: 0.5mm Angle 60°: 0.65mm |
||
| 162 | 1.80mm<T≤2.00mm Angle30°: 0.5mm Angle 45°: 0.55mm Angle 60°: 0.7mm |
1.80mm<T≤2.00mm Angle30°: 0.5mm Angle 45°: 0.55mm Angle 60°: 0.7mm |
||
| 163 | T≥2.05mm Angle30°: 0.55mm Angle 45°: 0.6mm Angle 60°: 0.75mm |
T≥2.05mm Angle30°: 0.55mm Angle 45°: 0.6mm Angle 60°: 0.75mm |
||
| 164 | V-CUT angle | 20°、30°、45°、60° | 20°、30°、45°、60° | |
| 165 | V-CUT angle tolerance | +/-5° | +/-5° | |
| 166 | Angle of golden finger chamfer | 20°、30°、45°、60° | 20°、30°、45°、60° | |
| 167 | Depth tolerance of golden finger chamfer | +/-0.1mm | +/-0.1mm | |
| 168 | Angle tolerance of golden finger chamfer | +/-5° | +/-5° | |
| 169 | The spacing of jumping v-cut | 8mm | 8mm | |
| 170 | V-CUT board thickness | 0.4--3.0mm | 0.4--3.0mm | |
| 171 | Remaining thickness of V-CUT,(T=board thickness) | 0.4mm≤T≤0.6mm : 0.2±0.1mm | 0.4mm≤T≤0.6mm : 0.2±0.1mm |
|
| 172 | 0.6mm≤T≤0.8mm : 0.35±0.1mm | 0.6mm≤T≤0.8mm : 0.35±0.1mm | ||
| 173 | 0.8mm＜T＜1.6mm : 0.4±0.13mm | 0.8mm＜T＜1.6mm : 0.4±0.13mm | ||
| 174 | T ≥1.6mm : 0.5±0.13mm | T ≥1.6mm : 0.5±0.13mm | ||
| 175 | Minimum board thickness | Minimum board thickness | 1L： 0.15mm +/-0.05mm (only for ENIG surface) Max. unit size: 300*300mm |
1L: 0.3mm +/-0.1mm (only for immersion silver, OSP surface) Max. unit size: 300*300mm |
| 176 | 2L:0.2mm +/-0.05mm (only for ENIG surface) Max. unit size: 350*350mm |
2L: 0.3mm +/-0.1mm (only for immersion silver, OSP surface) Max. unit size: 300*300mm |
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| 177 | 4L: 0.4mm +/-0.1mm (only for ENIG, OSP, immersion tin, immersion silver) Max. unit size: 350*400mm |
4L: 0.8mm +/-0.1mm, Max. unit size: 500*680mm |
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| 178 | 6L: 0.6mm +/-0.1mm Max. unit size: 500*680mm |
6L: 1.0mm +/-0.13mm Max. unit size: 500*680mm |
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| 179 | 8L: 0.8mm +/-0.1mm Max. unit size: 500*680mm |
8L: 1.2mm +/-0.13mm Max. unit size: 300*300mm |
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| 180 | 10L: 1.0mm +/-0.1mm Max. unit size: 400*400mm |
10L: 1.4mm +/-0.14mm Max. unit size: 300*300mm |
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| 181 | 12L: 1.4mm +/-0.13mm Max. unit size: 350*400mm |
12L: 1.6mm +/-0.16mm Max. unit size: 300*300mm |
||
| 182 | 14L: 1.6mm +/-0.13mm Max. unit size: 350*400mm |
14L: 1.8mm +/-0.18mm Max. unit size: 300*300mm |
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| 183 | 16L: 1.8mm +/-0.16mm Max. unit size: 350*400mm |
/ | ||
| 184 | Others | Impedance | Tolerance of inner layer +/-5% Tolerance of outer layer +/-10% |
Impedance tolerance: +/-10% |
| 185 | ≤10 groups | ≤5 groups | ||
| 186 | Coil board | No inductance required | No inductance required | |
| 187 | Ion contamination | ＜1.56 ug/cm2 | ＜1.56 ug/cm2 | |
| 188 | Warpage | 0.5% (symmetrical lamination, the discrepancy of residual copper ratio within 10% , uniform copper covered, no bare layer ) | 1L <1.5%, Above 2L <0.75% | |
| 189 | IPC standard | IPC-3 | IPC-2 | |
| 190 | Metal edge | Ring-free metal edge (excluding HASL surface) |
10mil ring metal edge (excluding HASL surface) |
|
| 191 | Min. width of connecting rib: 2mm Min. connecting position: 4 places |
Min. width of connecting rib: 2mm Min. connecting position: 6 places |
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| 192 | Silk screen serial number | can | / | |
| 193 | QR code | can | can | |
| 194 | Test | Minimum distance between test point and board edge | 0.5mm | 0.5mm |
| 195 | Minimum test on resistance | 10Ω | 10Ω | |
| 196 | Maximum insulation resistance | 100MΩ | 100MΩ | |
| 197 | Maximum test voltage | 500V | 500V | |
| 198 | Minimum test pad | 4mil | 4mil | |
| 199 | Minimum distance between test pads | 4mil | 4mil | |
| 200 | Maximum test electric current | 200mA | 200mA | |
| 201 | Maximum board size for flying pin test | 500*900mm | 500*900mm | |
| 202 | Maximum board size for fixture tooling test | 600*400mm | 600*400mm | |
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